SV Thermal Conductive Two Component 1:1 electronic potting Compositum Sigillum Pro Junction Box

SV Thermal Conductivae Duae Component 1:1 electronic potting sigillum compositum pro Junctione Box Imaginum Featured

Brevis descriptio:

SV electronic potting compositi Sealant designatus est pro potting et IMPERVIUS pro LED auriga, ballasts, et e contrario in raedam sensoriis.

Mitte ad nos inscriptio

Product Detail

Product Tags

Product Description

FEATURES

1. Humilis viscositas, bona fluiditas, ieiunium bullae dissipatio.

2. Optima insulatio electrica et calor conductio.

3. Potest penitus potting sine generatione substantiarum hypotheticarum in curatione inferiorum, habet valde demissam deformitatem et excellentem adhaesionem partium.

PACKAGING
A:B=1:1

Pars: 25 KG

B partem: 25 KG

Basic USUS

1. Potting et IMPERVIUS pro DUXERIT exactoris, ballasts, et vicissim raedam sensoriis.

2. Insulatio, conductio scelerisque, probatio humoris et functiones fixationis in aliis componentibus electronicis

TYPICA POTESTAS

Hi valores non intenduntur ad usum in specificationibus parat

POSSESSIO	A	B
ante Mixturam	Aspectus	White	Niger
(25℃,65%RH)	Viscositas	2500±500	2500±500
	Densitas (25℃, g/cm³)	1.6±0.05	1.6±0.05
Post Mixtum	Propor- tio (By Pondus)	1	1
(25℃,65%RH)	Color	Gray
	Viscositas	2500~3500
	Operatio Tempus (min)	40~60
	Tempus curationis (H, 25)	3~4
	Tempus curationis (H, 80℃)	10~15
Post Curing	Duritia (Shore A)	55±5
(25℃,65%RH)	Distrahens fortitudo (Mpa)	≥1.0
	Conductivity scelerisque (W/m·k)	≥0.6~0.8
	Dielectrica fortitudo (KV/mm)	≥14
	Dielectric Constant (1.2MHz)	2.8~3.3
	Volumen Resistentia (Ω·cm)	≥1.0×1015
	Coëfficiens Linearis Expansionis (m/m·k)	≤2.2×10-4
	Temperature opus (℃)	-40~100